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    "url": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/6BZPGGLROWJHEHY4VTJ4L7UZ42PVEPVR/",
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    "message_id": "[email protected]",
    "message_id_hash": "6BZPGGLROWJHEHY4VTJ4L7UZ42PVEPVR",
    "thread": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/thread/KYYG6EXV4ZEGDMGRGYOUMNSJRBNHLAS2/",
    "sender": {
        "address": "rjansson (a) cfl.rr.com",
        "mailman_id": "9b211bcd8a0642788e6dc055f3930699",
        "emails": "https://mailman.amsat.org/hyperkitty/api/sender/9b211bcd8a0642788e6dc055f3930699/emails/"
    },
    "sender_name": "Dick Jansson-rr",
    "subject": "[eagle] Re: Revised Module Suggestion",
    "date": "2007-10-16T15:02:47Z",
    "parent": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/SQFG2ARXUU5QFFVJZIRYN637M5P7NXPQ/",
    "children": [
        "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/L3ON36YFDFN6R6FRAVFORTVPHO4WWW74/"
    ],
    "votes": {
        "likes": 0,
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        "status": "neutral"
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    "content": "Juan:\n \nThere is another issue that comes to mind regarding \"specialized\" modules.\nIn a program such as Eagle we will need to create an acceptable module\ndesign that is useful for many applications in the mission and then turn on\nthe fabrication machinery for producing these long before the electronic\nforces are ready to populate them for flight. On P3D in 1992-3 we gambled\nand manufactured a very many module parts, expecting that we would have some\nspares left over - wrong! Even with this quite large quantity of parts (and\nat that time there was criticism that we were making too many) we ran out\nbefore flight and had to make some more.\n \nFabricating module parts for this program is a guessing game, with some\nestimates of needing to construct up to 80 sets of parts, and that may not\nbe enough. You can do the detailed program mathematics and come up with some\nnumber and I will be willing to bet that you end up on the wrong side of\nthat guess. It's a dicey game.\n \nThe lesson in this is that we must create a generic module design and\nhardware that can be adapted for many different assignments in the\nspacecraft. Save for your specialized need, we have no indication of any\nother specialized module needs. This is why I prefer to adapt a generic\nmodule to your needs with the added heat sinks, rather than make just a\nspecially machined device just for your needs. And if we do, we will\nprobably not have enough of them. This is why I prefer to have a generic\nmodule design and then carefully adapt it as required for specialized module\nneeds. We will be flying more than just the U receiver!.\n \n'73,\nDick Jansson, KD1K\n <mailto:[email protected]> [email protected] \n <mailto:[email protected]> [email protected] \n \nFrom: [email protected] [mailto:[email protected]] On Behalf Of Juan Rivera\nSent: Monday, 15 October, 2007 15.38\nTo: Dick Jansson-rr\nCc: Bob Davis; AMSAT Eagle\nSubject: Re: [eagle] Revised Module Suggestion\n \nDick,\n \nThat looks nice!  It appears to solve the issue of getting that front panel\nat exactly 90 degrees to the baseplate and also increases the stiffness of\nthe baseplate.  Increasing the useful front panel space also eases the\nproblem of working around the CAN-Do PCB with all of the necessary I/O\nconnectors. \n \nWould it be possible to customize the baseplate for the few modules that\ndraw high power?  It would be nice to machine the baseplate and heat sinks\nas one chunk of metal instead of the existing method of having several\nindividual heat sink pieces.  I would like to see the PCB laying flat on top\nof the baseplate with milled cutouts to accommodate any devices attached to\nthe bottom side.  In a perfect world there would be no components on the\nbottom and the PCB would make contact with the baseplate across the entire\nsurface.  Another possibility that might be worth considering would be the\nability to include \"U\" shaped heat sinks that would bridge over the top side\nof hot components and attach to the baseplate through holes cut into the PCB\non either side of the component.  Thermal gap filler could allow room for\nCTE mismatches so that the device isn't crushed. \n \n73,   Juan - WA6HTP\n\n\n\n \n\n\n",
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