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{
    "url": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/C2F36ERHGKOT6C6OQDACRWW5NUUIMQXR/?format=api",
    "mailinglist": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/?format=api",
    "message_id": "002301c754e0$ad469500$0800000a@LAPTOP9",
    "message_id_hash": "C2F36ERHGKOT6C6OQDACRWW5NUUIMQXR",
    "thread": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/thread/GWQFF2WSLRLDYSEOFQRK2DMUHYM4JQOG/?format=api",
    "sender": {
        "address": "eagle (a) howardlong.com",
        "mailman_id": "a9c59876bf364a4fb3565b10d9755577",
        "emails": "https://mailman.amsat.org/hyperkitty/api/sender/a9c59876bf364a4fb3565b10d9755577/emails/?format=api"
    },
    "sender_name": "Howard Long",
    "subject": "[eagle] Re: URx",
    "date": "2007-02-20T11:17:15Z",
    "parent": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/GWQFF2WSLRLDYSEOFQRK2DMUHYM4JQOG/?format=api",
    "children": [
        "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/QN6ASCM6VTOIX5DBTMHDJNRZX7AHSUMX/?format=api"
    ],
    "votes": {
        "likes": 0,
        "dislikes": 0,
        "status": "neutral"
    },
    "content": "Hi Dick, John,\n \n> Device       Dissipation     Delivered \n> U16           0.340             0.850\n> U17           0.411\n> U18           0.384             1.200\n> U19           0.108             0.090\n> U20           0.040             0.224\n>                 ------------        ------------\n> Totals       1.283W          2.364W\n> \n> For a grand total power dissipation of the power system of 3.647W.  \n\nI am particularly interested in this as the DSP device on the SDX\n(TMS320C6726) typically dissipates 857mW at its full 250MHz speed. It is a\n144 pin LQFP PowerPad device and has a metal plate directly underneath the\ndie that is designed to be soldered directly to the PCB ground plane.\n\nIn order to conduct heat away, TI recommend the optimum to be 100 0.33mm\nvias in a 10x10 matrix.\n\nSee http://www.g6lvb.com/dspthermal.jpg for the design I developed for the\nprototype I use for my software development.\n\nWe will almost certainly need to conduct heat away from the device on the\nunderside, so that would suggest to me a direct metallic interface between\nthe board and the module housing, either milled out of the chassis itself or\nwith an interfacing block. IT should be noted that for electrical reasons\nthere are also 44 decupling capacitors on the bottom of the PCB that need to\nbe considered when providing the thermal interface.\n\nWe also would need some space rated goo to ensure good thermal conductivity\nbetween the PCB and the heatsink - I am sure someone will know what this is!\n\nOne final thing - 3.647W seems very high for the receiver function. Is this\nbased on real figures or device spec sheets, and if the latter are these\nworst case or typical values?\n\n73, Howard G6LVB\n\n\n\nPowerPADT Thermally Enhanced Package\nhttp://focus.ti.com/lit/an/slma002a/slma002a.pdf\n\nPowerPADT Layout Guidelines\nhttp://focus.ti.com/lit/an/sloa120/sloa120.pdf\n\nPowerPADT Made Easy\nhttp://www-s.ti.com/sc/psheets/slma004b/slma004b.pdf\n\n",
    "attachments": []
}