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    "url": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/GWQFF2WSLRLDYSEOFQRK2DMUHYM4JQOG/?format=api",
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    "message_id": "001101c750ff$a4ec4a60$0971cf44@djxe18",
    "message_id_hash": "GWQFF2WSLRLDYSEOFQRK2DMUHYM4JQOG",
    "thread": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/thread/GWQFF2WSLRLDYSEOFQRK2DMUHYM4JQOG/?format=api",
    "sender": {
        "address": "rjansson (a) cfl.rr.com",
        "mailman_id": "9b211bcd8a0642788e6dc055f3930699",
        "emails": "https://mailman.amsat.org/hyperkitty/api/sender/9b211bcd8a0642788e6dc055f3930699/emails/?format=api"
    },
    "sender_name": "Dick Jansson-rr",
    "subject": "[eagle]  URx",
    "date": "2007-02-15T12:48:50Z",
    "parent": null,
    "children": [
        "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/C2F36ERHGKOT6C6OQDACRWW5NUUIMQXR/?format=api"
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    "content": "John:\n \nPer your suggestion, I have examined your data for the U band Receiver. I\nshall first examine the power supplies for the receiver. The data that I\nhave elicited from your information is as follows, powers in Watts:\nDevice       Dissipation     Delivered \nU16           0.340             0.850\nU17           0.411\nU18           0.384             1.200\nU19           0.108             0.090\nU20           0.040             0.224\n                ------------        ------------\nTotals       1.283W          2.364W\n \nFor a grand total power dissipation of the power system of 3.647W. Of the\ndelivered power you have identified two devices that suck up (U2 = 0.490W\nand U3 = 0.388W) a total of 0.878W. It is not clear where the remaining\n1.486W is dissipated. Your help in identifying where this thermal energy is\ndumped in the module would be helpful, just to make sure that no stone\nremains unturned in this matter of handling these dissipations. Hot\nresistors could be an issue of concern......\n \nYou talk (somewhat glibly) of sinking regulator devices to PCB copper pads\nand such. For at least five devices, U2, U3, U16, U17, & U18 I consider that\nsuch mounting is not acceptable as such concentrated dissipations,\nexacerbated by the vacuum environment, must be treated more specifically in\nachieving heat sinking to the module housing. The module Base Plate, drawing\nE05 21, being of somewhat robust 1.6mm thick aluminum should help\nsignificantly in dissipating these module powers. More direct thermal\ncoupling methods are going to be needed in this module to get that heat to\nthe Base Plate. PCB thermal conductivities, even enhanced by added copper,\nare not good at all and cannot really be depended upon in these situations.\n \nWith this module \"pushing\" the envelop of module power rating, baring a full\nheatsink module, it is clear that the coatings of the module will not be\nbare aluminum. This raises the ante in the picture of keeping command-level\nmodules from getting too cold in the eclipse situation. The original concept\nfor maintaining full control of the spacecraft through a 3 hour eclipse,\nwhere the spaceframe can be as low as -130°C or lower, low power,\ncommand-sensitive modules would not become dangerously cold, provided that\ntheir dissipations are indeed low and the thermal coatings highly\nreflective. If on the other hand we depend upon higher dissipation modules,\nsuch as this URx, then the module temperatures may be a concern in the\neclipse situation. This is all subject to detailed analytic examination upon\nthe construction of a full spacecraft analytic model, which we do not have\nat the moment, we first need a detailed mechanical design before having that\nanalytic model.\n \nIn any event, this URx presents a significant thermal challenge. Solving\nthis challenge first needs an understanding of the physical bodies of these\ndevices of the forenoted concern. Can you provide me with the physical\ninformation on these devices, either directly or by URL? Can you also\nrespond to my earlier question on where the rest of the power dissipation\nresides? By one means or another we need to engineer a more direct thermal\nconnection between these devices and the E05 21 Base Plate, which may\nrequire some inventiveness of our collective crania.\n \n'73,\nDick Jansson, KD1K\n(ex: WD4FAB)\[email protected] \n---------------------------\n\n \n\n\n\n",
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