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{
    "url": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/L3ON36YFDFN6R6FRAVFORTVPHO4WWW74/?format=api",
    "mailinglist": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/?format=api",
    "message_id": "[email protected]",
    "message_id_hash": "L3ON36YFDFN6R6FRAVFORTVPHO4WWW74",
    "thread": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/thread/KYYG6EXV4ZEGDMGRGYOUMNSJRBNHLAS2/?format=api",
    "sender": {
        "address": "greencl (a) mindspring.com",
        "mailman_id": "5421c5ff9a12494f8f7bd304db4ac696",
        "emails": "https://mailman.amsat.org/hyperkitty/api/sender/5421c5ff9a12494f8f7bd304db4ac696/emails/?format=api"
    },
    "sender_name": "Chuck Green",
    "subject": "[eagle] Re: Revised Module Suggestion",
    "date": "2007-10-16T15:15:18Z",
    "parent": "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/6BZPGGLROWJHEHY4VTJ4L7UZ42PVEPVR/?format=api",
    "children": [
        "https://mailman.amsat.org/hyperkitty/api/list/[email protected]/email/ENNSDG5ZHKEKXASBINO54QMZOCDS2IXK/?format=api"
    ],
    "votes": {
        "likes": 0,
        "dislikes": 0,
        "status": "neutral"
    },
    "content": "Hi Dick,\n\nWhen considering special needs, don't forget that the IHU has already \nbeen designed and will need a box to accommodate it. You did this once, \nbut with the new box designs, it may need to be done again.\n\nChuck\n\nDick Jansson-rr wrote:\n>\n> Juan:\n>\n> There is another issue that comes to mind regarding “specialized” \n> modules. In a program such as Eagle we will need to create an \n> acceptable module design that is useful for many applications in the \n> mission and then turn on the fabrication machinery for producing these \n> long before the electronic forces are ready to populate them for \n> flight. On P3D in 1992-3 we gambled and manufactured a very many \n> module parts, expecting that we would have some spares left over – \n> wrong! Even with this quite large quantity of parts (and at that time \n> there was criticism that we were making too many) we ran out before \n> flight and had to make some more.\n>\n> Fabricating module parts for this program is a guessing game, with \n> some estimates of needing to construct up to 80 sets of parts, and \n> that may not be enough. You can do the detailed program mathematics \n> and come up with some number and I will be willing to bet that you end \n> up on the wrong side of that guess. It’s a dicey game.\n>\n> The lesson in this is that we must create a generic module design and \n> hardware that can be adapted for many different assignments in the \n> spacecraft. Save for your specialized need, we have no indication of \n> any other specialized module needs. This is why I prefer to adapt a \n> generic module to your needs with the added heat sinks, rather than \n> make just a specially machined device just for your needs. And if we \n> do, we will probably not have enough of them. This is why I prefer to \n> have a generic module design and then carefully adapt it as required \n> for specialized module needs. We will be flying more than just the U \n> receiver!.\n>\n> ’73,\n>\n> Dick Jansson, KD1K\n>\n> [email protected] <mailto:[email protected]>\n>\n> [email protected] <mailto:[email protected]>\n>\n> *From:* [email protected] [mailto:[email protected]] *On Behalf Of *Juan \n> Rivera\n> *Sent:* Monday, 15 October, 2007 15.38\n> *To:* Dick Jansson-rr\n> *Cc:* Bob Davis; AMSAT Eagle\n> *Subject:* Re: [eagle] Revised Module Suggestion\n>\n> Dick,\n>\n> That looks nice! It appears to solve the issue of getting that front \n> panel at exactly 90 degrees to the baseplate and also increases the \n> stiffness of the baseplate. Increasing the useful front panel space \n> also eases the problem of working around the CAN-Do PCB with all of \n> the necessary I/O connectors.\n>\n> Would it be possible to customize the baseplate for the few modules \n> that draw high power? It would be nice to machine the baseplate and \n> heat sinks as one chunk of metal instead of the existing method of \n> having several individual heat sink pieces. I would like to see the \n> PCB laying flat on top of the baseplate with milled cutouts to \n> accommodate any devices attached to the bottom side. In a perfect \n> world there would be no components on the bottom and the PCB would \n> make contact with the baseplate across the entire surface. Another \n> possibility that might be worth considering would be the ability to \n> include \"U\" shaped heat sinks that would bridge over the top side of \n> hot components and attach to the baseplate through holes cut into the \n> PCB on either side of the component. Thermal gap filler could allow \n> room for CTE mismatches so that the device isn't crushed.\n>\n> 73, Juan - WA6HTP\n>\n>\n> ------------------------------------------------------------------------\n>\n> _______________________________________________\n> Via the Eagle mailing list courtesy of AMSAT-NA\n> [email protected]\n> http://amsat.org/mailman/listinfo/eagle\n>   \n",
    "attachments": []
}