Bob:

 

Here are my first comments regarding your Eagle Module Requirements document. These are first brush and I reserve the right to add to them. J 

 

1)     6.8:  I would suggest restricting the drawing sizes to “A” and “B”, as we did for AO-40, as it allows the use of easily available reproduction machinery, both in creation and replication, and in the standardization of the handling of the drawings.

2)     6.10:  I would suggest that the term “…hardware elements (screws)...” be used instead of “...hardware joints…” This more specific reference makes clear that requirement.

3)     7.4:  You speak of “generic”, generic what is your reference?

4)     7.10:  What is meant here?

5)     8.5:  To accommodate a maximization of the spaceframe Izz, I found that I had to move the equipment panels outward as far as possible to be able to achieve this needed Izz. This step removed a lot of otherwise vacant space above the modules, thus restricting the over height of the modules, which would probably preclude the stacking of modules. Further, I don’t feel that the AO-40 stacking experience was all that good. On the thermal arena and stacking, stacked modules do not radiate their heat very well and such stacking would be somewhat thermally restrictive.

6)     9.9:  Good!

7)     You have made no provision for the creation of a “heat sink” module that will be necessary for the really high power modules, defined hereby as greater than 5+ Watts for a 125x180 module. Also the inclusion of small heat sinks, as done for the recent URx work, does not seem to have a home in your document.

 

I hope that these comments will help you and others.

 

’73,

Dick Jansson, KD1K

[email protected]

[email protected]