John:
This will be my concluding note on this subject prior to the Symposium. I have tuned the analyses done yesterday and that data follows.
For a single 1.4mil ground plane with a single IC located 52mm from the Baseplate edge, a 1.0W dissipation results in a temperature rise of 38.2°C
For a double 1.4mil ground plane with a single IC located 28mm from the Baseplate edge, a 1.0W dissipation results in a temperature rise of 21.1°C.
For a double 1.4mil ground plane with TWO ICs, spaced 40mm and both located 28mm from the Baseplate edge, a 1.0W dissipation in each IC results in temperature rises of 26.1°C (one at 26.0 and the other at 26.2). Total dissipation here is 2.0W.
In other words, doubling the ICs, with this spacing, only added ~24% to the temperature rise. This shows you how this module design handles the kind of power situations that you have in the URx.
See you in Pittsburgh?
73, Dick Jansson, KD1K mailto:[email protected] [email protected] mailto:[email protected] [email protected]